2004

• IC Tray Recycling Business
• Wafer Cassette (ePAK)
• Consumable part for Subcon

2008

• ASEM Agent (Memory PKG Sub for Samsung)
• SK Hynix business since 2013
• Kyocera Agent Contract since 2016

2013

• Injection Molding for Tray cap, Clip, Reel and plastic parts
• MBB and packing materia
• IC Carrier Tape

2017

• Injection Molded IC Shipping Tray
• Facility Expansion

2022

• Factory Expansion for IC Tray
• (DANPLA) production